Silicon AnalyticaGlossary · Packaging
What is CoWoS?
CoWoS (Chip-on-Wafer-on-Substrate) is TSMC’s family of advanced packaging technologies that place processors and memory stacks side by side on an interposer within one package. It is widely used for AI accelerators that combine GPUs or custom chips with HBM.
Why it matters for investors
Packaging capacity of this type has at times limited how many AI accelerators could be shipped, so plans to expand CoWoS capacity are closely followed. TSMC discusses advanced packaging as part of its quarterly results.
Capacity additions also create demand for related equipment and for substrates and interposers from other suppliers.
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General educational explanation. Information only, not investment advice.