Silicon AnalyticaPackaging, substrates & materials
BE Semiconductor Industries (Besi)
Latest quarter: Q2 2026, ended June 2026
BESI · Euronext AmsterdamPackaging, substrates & materials
Compare in FinancialsAbout the company
Die attach and hybrid bonding equipment for advanced packaging.
Key figures
Q2 2026 · 30 Jun 2026
- Revenue
- ▲ +68.7% YoY y/y
- Gross margin
- Operating margin
- —
- Net income
- Free cash flow
- —
Figures from company filings. Calculated values marked Calc. · Methodology →
Quarters
| Metric | Q2 2026 |
|---|---|
| Revenue | |
| Revenue growth | |
| Gross margin | |
| Operating margin | Not available |
| Net income | |
| Diluted EPS | Not available |
| R&D | Not available |
| R&D % of revenue | Not available |
| Free cash flow | Not available |
Verified figures only. “Not available” means no verified value is recorded for that period; nothing is estimated.
Sources
- Besi Announces Q2-26 and H1-26 Results · 2026-07-23