According to SIA, funding for the CHIPS R&D programs totals approximately $11 billion over several years. The NSTC has $6.3 billion available through a long-term funding agreement.

Status as of June 2025

The advanced packaging program NAPMP had finalized $300 million in awards for its first funding opportunity, plus a $1.1 billion contract for the Advanced Packaging Piloting Facility. Further awards worth $1.6 billion had not yet been announced.

Age of the information

The status is from June 2025 and is probably outdated. Readers should check the current status of the awards.

AW

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